China IC Unicorn Alliance - Automotive Chip Summit

时间

主题

9:55-10:00

Address

Jack Wang，Secretary General of China IC Unicorn Alliance、CEO of Beijing XHH tech. co., LTD. 

10:00-10:30

Development Trends of Automotive Chip Standards and Evaluation Technologies

Xia Xianzhao，Vice Secretary General of China Automotive Chip Standard Testing and Certification Alliance、Chief Expert of China Automotive Technology&Research Center Co. Ltd 

10:30-10:50

Cross-domain integrated computing chips empower the accelerated development of smart vehicles

Daniel Wang，Senior Product Marketing Director，Black Sesame Technologies Co., Ltd. 

10:50-11:10

MEMSIC sensors are used in the automotive market

MEMSIC Senior Product Manager Roger

11:10-11:30

Automotive IGBT chips,devices and applications

Xiangyou Zeng，Marketing Technical Director，Shanghai Lu-Semi Technology Co., Ltd.

11:30-11:50

Hangshun Automotive MCU, Helping the Localization of Automotive Electronics

 Frank Zheng，Director of the Product Department ，Shenzhen Hangshun Chip Technology R&D Co., Ltd.

13:30-14:00

The Art of Data Storage in Smart Vehicles

YE YUAN，Senior Marketing Manager ，YEESTOR Microelectronics Co., Ltd.

14:00-14:30

HPM6800: A new generation of Digital Display and HMI system Platform

Zhendong Fei， Embedded Systems Expert and Product Director， HPMicro Semiconductor Co.,Ltd.

14:30-15:00

Chipways One-Stop Automotive Chipsets for Automotive BMS and Motor Control Applications

John Zhang，Chipways Semiconductor FAE Manager

15:00-15:30

Smart Power MOS - Application and Technical Analysis of Smart High-Side Switches

Liao Weibao， R&D Manager ，Shenzhen Winsemi Microelectronics Co., Ltd

15:30-16:00

Automotive Signal Improvement (SIC) CAN FD transceiver products and applications Introduction

Wyman.Liu，Global Region / Product Line Manager，Hunan Silicon Internet of Things Technology Co.,Ltd

16:00-16:30

Advances in Automotive Power Semiconductors

Cai Xiongfei，Vice General Manager，BASiC Semiconductor Ltd.